Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Patent
1991-04-08
1992-12-22
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With stress relief
257687, H01L 2330, H01L 2304
Patent
active
051737647
ABSTRACT:
A semiconductor device (20) has reduced die stress by incorporating a lid (30) which constrains the expansion and contraction of an encapsulant. In one embodiment, a semiconductor die (22) having an active surface (23) is coupled to a plurality of leads (24). An encapsulant (28) is disposed on the active surface. The lid (30) overlies the active surface (23) and is adhesively coupled to the semiconductor die (22) by the encapsulant (28). The lid is of a material which has a coefficient of thermal expansion which closely approximates that of the semiconductor die in order to prevent stress build-up in the die which is normally caused by higher rates of expansion and contraction of the encapsulant in comparison to the those of the semiconductor die.
REFERENCES:
patent: 4712129 (1987-12-01), Orcutt
Clark S. V.
Goddard Patricia S.
James Andrew J.
Motorola Inc.
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