Semiconductor device having a multilayer interconnection structu

Details Semiconductor device having a multilayer interconnection structu Semiconductor device having a multilayer interconnection structu

1995-08-10

1996-06-25

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257735, H01L 23495, H01L 2348

Patent

active

055302823

ABSTRACT:
A semiconductor device having a increased freedom of design in the connection between an electrode and one or more inner leads. In a semiconductor device 2, a semiconductor element 4 is fixed onto a die pad 2 which is a part of a lead frame. On the surface of the semiconductor element 4 is formed an electrode (bonding pad) 5, which is electrically connected to an inner lead 3 through a bridge structure 10 comprising an insulating film 11 deposited at a lowermost position and a conductive thin film pattern 12 formed thereon.

REFERENCES:
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 5304843 (1994-04-01), Takubo et al.
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5349238 (1994-09-01), Ohsawa et al.

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