Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-05-09
2006-05-09
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S618000, C438S598000, C438S453000, C438S624000, C438S625000, C438S637000, C257S642000, C257S751000, C257S752000, C257S759000
Reexamination Certificate
active
07041586
ABSTRACT:
A semiconductor device includes a multilayer interconnection structure including an organic interlayer insulation film in which a conductor pattern is formed by a damascene process, wherein the organic interlayer insulation film carries thereon an organic spin-on-glass film.
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Ikeda Masanobu
Kudo Hiroshi
Ohkura Yoshiyuki
Watanabe Ken'ichi
Baumeister B. William
Fujitsu Limited
Westerman Hattori Daniels & Adrian LLP
Yevsikov Victor V.
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