Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-05-11
1996-06-04
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257668, 257700, 257704, 257784, H01L 2348, H01L 23495, H01L 2312
Patent
active
055236219
ABSTRACT:
In order to set the potential of corner leads formed from a lead frame equal to that of power source leads such as ground, a multilayer wiring substrate is mounted on a mounting substrate of a package and its potential is set equal to that of the power source leads, or a multilayer mounting substrate is formed to electrically connect electrode pads of a semiconductor substrate to the power source and corner leads by bonding wires. The inductance of the power source leads can be lowered, and the number of signal leads interposed between the power source leads can be reduced to the minimum. Consequently, variations in frequency used in the entire package can be prevented, and impedance matching can be made.
REFERENCES:
patent: 3825805 (1974-07-01), Belohoubeck et al.
patent: 4558346 (1985-12-01), Kida et al.
patent: 4947234 (1990-08-01), Einzinger et al.
patent: 4984065 (1991-01-01), Sako
patent: 4985753 (1991-01-01), Fujioka et al.
patent: 5311057 (1994-05-01), McShane
patent: 5332864 (1994-07-01), Liang et al.
Hille Rolf
Kabushiki Kaisha Toshiba
Ostrowski David
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