Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1996-02-20
1998-04-14
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257773, 257774, 257786, H01L 2348, H01L 2352
Patent
active
057395870
ABSTRACT:
The present invention relates to a pad for connecting external connection terminals such as bonding wires to IC chip. The present invention provides a semiconductor device having upper and lower electrode layers and an interlayer insulation film therebetween, the interlayer insulation film including a through hole which is formed therethrough at a given location. An interlayer connection conductor is embedded in the through hole. For example, the ball-like portion of the bonding wire may be connected to the upper electrode layer such that the ball-like portion perfectly covers the embedded conductor. Such an arrangement will not create any step. Therefore, the bonding area can be easily ensured to facilitate a further formation of more layers. The embedded metal will not be adversely affected by moisture moved into along the bonding wire. The external connection terminal may be of any suitable form such as bump electrode and film carrier. The present invention may be broadly applied as a connection technique for these terminals. It is particularly important to secure a desired bonding area and to provide any measure against larger pressing and separating forces if the connection is made using the bonding wire. In view of improvement of the reliability, the present invention is effective. The through holes may be replaced by grooves into each of which an interlayer connection conductor is embedded. If the plane configuration in the grooves is modified, moisture can be more effectively prevented from entering the semiconductor device through the outer periphery of the IC chip.
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Ostrowski David
Seiko Epson Corporation
Thomas Tom
LandOfFree
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