Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-12-14
2008-07-29
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S106000
Reexamination Certificate
active
07405148
ABSTRACT:
A semiconductor device for being mounted on the display panel board of a display apparatus includes a substrate; a plurality of circuit units disposed on the substrate and including thin-film transistors, the circuit units having respective output terminals; at least one bus interconnect for supplying a voltage to the circuit units; and a power supply feed point for supplying a voltage from an external source to the bus interconnect. The pitch L (m) of the circuit units, the number N of the circuit units, and the resistance R (Q/m) per unit length of the at least one bus interconnect are related to each other as follows:in-line-formulae description="In-line Formulae" end="lead"?R×N2×L≦4×103.in-line-formulae description="In-line Formulae" end="tail"?
REFERENCES:
patent: 5818114 (1998-10-01), Pendse et al.
patent: 3033123 (1992-01-01), None
patent: 2002-303878 (2002-10-01), None
patent: 2003-029292 (2003-01-01), None
patent: 2003-100982 (2003-04-01), None
Dickstein & Shapiro LLP
NEC Corporation
Pham Long
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