Semiconductor device having a leadframe and metal substrate

Details Semiconductor device having a leadframe and metal substrate Semiconductor device having a leadframe and metal substrate

1995-01-17

1995-09-05

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257670, 257674, 257787, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

054481058

ABSTRACT:
A leadframe according to this invention is formed by bonding a single leadframe with a substrate using adhesive film or double-sided adhesive resin film, which is divided and attached to two or more predetermined points between them. This reduces the quantity of gas or contaminants generated from adhesives. Also, this results in the reduction of the stress generated during heat treatment of the leadframe and also in the elimination of warping of the lead frame due to thermal stress. Cracking does not occur on the resin because resin is removed easily and assuredly, and no air is left behind. This contributes to high reliability and increased productivity. The lead frame is further formed by bonding a plurality of metal substrates of different materials to single leadframe. This through more stable thermal behavior high reliability.

REFERENCES:
patent: 3626259 (1971-12-01), Torrance et al.
patent: 4677526 (1987-06-01), Muehling
patent: 4858073 (1989-08-01), Gregory
patent: 4931854 (1990-06-01), Yonemasu et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 5012322 (1991-04-01), Guillotte et al.
patent: 5155299 (1992-10-01), Mahulikar et al.

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