Semiconductor device having a lead clamping arrangement

Details Semiconductor device having a lead clamping arrangement Semiconductor device having a lead clamping arrangement

1998-01-16

1999-12-07

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Device held in place by clamping

257666, 257676, 257726, H01L 2334, H01L 23495

Patent

active

059988665

ABSTRACT:
A plurality of connecting leads, each consisting of an internal lead and an external lead, are provided so as to extend inward from a lead frame main body, and are then cut off the lead frame main body. The connecting leads are electrically connected with an aluminum electrode of the semiconductor chip. A plurality of fixing leads, each having a distal end bent toward the semiconductor, are provided so as to extend inward from the lead frame main body and thereafter are cut off the lead frame main body. The semiconductor chip is clamped by the distal ends of the fixing leads. The semiconductor chip, the plural connecting leads and the plural fixing leads are sealed together into a resin package.

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patent: 5776802 (1998-07-01), Ochi et al.
patent: 5783861 (1998-07-01), Son
patent: 5821628 (1998-10-01), Hotta

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