Semiconductor device having a layer of gallium amalgam on bump l

Details Semiconductor device having a layer of gallium amalgam on bump l Semiconductor device having a layer of gallium amalgam on bump l

1996-06-13

1997-09-30

Whitehead, Jr., Carl W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

257738, 257762, 257763, 257764, 257766, 257768, H01L 2348, H01L 2352, H01L 2940

Patent

active

056729138

ABSTRACT:
A semiconductor chip (10) has a plurality of metallized members (12) that are each advantageously bumped with a volume of gallium amalgam (18) to render the members wettable by a conventional solder.

REFERENCES:
patent: 3886578 (1975-05-01), Eastwood et al.
patent: 4396900 (1983-08-01), Hall
patent: 5053195 (1991-10-01), MacKay
patent: 5061442 (1991-10-01), Ozimek
patent: 5225157 (1993-07-01), MacKay
patent: 5373192 (1994-12-01), Eguchi
C.A. MacKay and G. Schuldt, "Applications of Amalgams in Microelectronic Bonding," ASM Electronics Mats. Congress, Cambridge, Massachusetts, Aug. 1992.
C.A. MacKay, "Amalgams for Improved Electronics Interconnection," IEEE Micro, Apr. 1993, pp. 46-58.

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