4. Metal fusion bonding
  5. Process
  6. Plural joints

Rajan D. Deshmukh

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Flip chip semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief
Reexamination Certificate

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Method of fabricating flip chip semiconductor device...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Optical grating fabrication process

Radiation imagery chemistry: process – composition – or product th – Including control feature responsive to a test or measurement
Reexamination Certificate

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Semiconductor device having a layer of gallium amalgam on bump l

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Solder self-alignment methods

Metal fusion bonding – Process – Plural joints
Patent

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Profile ID: LFUS-PAI-P-1160989

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