Semiconductor device having a high density plasma oxide layer

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

06841851

ABSTRACT:
A semiconductor device and a method for manufacturing the same, wherein a gate electrode structure is formed on a surface of a semiconductor substrate. Next, a gate poly oxide (GPOX) layer is deposited on a surface of the gate electrode structure and on the semiconductor substrate. Then, the surface of the semiconductor substrate is cleaned to remove any residue and the GPOX layer remaining on the semiconductor substrate. Next, an etch stopper is formed on the surface of the gate electrode structure and on the semiconductor substrate. Last, a high-density plasma (HDP) oxide layer is deposited on the etch stopper. The semiconductor device and method for manufacturing the same are capable of preventing bubble defects.

REFERENCES:
patent: 6156636 (2000-12-01), Yeom et al.
patent: 6165880 (2000-12-01), Yaung et al.
patent: 6218715 (2001-04-01), Kim et al.
patent: 6323103 (2001-11-01), Rengarajan et al.
patent: 6420250 (2002-07-01), Cho et al.
patent: 6465310 (2002-10-01), Lee et al.
patent: 6500678 (2002-12-01), Aggarwal et al.
patent: 11-097529 (1999-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device having a high density plasma oxide layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device having a high density plasma oxide layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a high density plasma oxide layer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3428043

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.