Semiconductor device having a heat-sink attached thereto

Details Semiconductor device having a heat-sink attached thereto Semiconductor device having a heat-sink attached thereto

1990-10-22

1992-05-26

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 74, 357 80, 361383, 361384, 361389, H01L 2302, H01L 2312, H02B 100, H05K 720

Patent

active

051172810

ABSTRACT:
A heat-sink is attached to a hermetic seal package of a face-up type semiconductor device such that a concavity is formed between the cap of the package and the heat-sink. Small holes using a vent are formed in the heat-sink between the concavity and the outside face of the heat-sink so as to communicate atmosphere outside the heat-sink to the concavity.

REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4649990 (1987-03-01), Kurihara et al.

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