Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation
Patent
1997-12-18
2000-02-22
Bowers, Charles
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
Insulated gate formation
H01L 213205
Patent
active
060279923
ABSTRACT:
The present invention relates to a process of forming a semiconductor device including forming a gallium and nitrogen bearing layer and forming at least one gate electrode over the gallium and nitrogen bearing barrier layer. The invention also includes a semiconductor device formed according to this process. In another embodiment, the invention includes a semiconductor device including a substrate, a gallium and nitrogen containing barrier layer disposed over the substrate, and at least one gate electrode disposed over the gallium and nitrogen bearing barrier layer.
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patent: 5502005 (1996-03-01), Mikagi
patent: 5612574 (1997-03-01), Summerfelt et al.
patent: 5684309 (1997-11-01), McIntosh et al.
patent: 5726087 (1998-03-01), Tseng et al.
M. Bhat et al., MOS Characteristics of Ultrathin NO-Grown Oxynitrides, IEEE, pp. 421-423, 1994.
Gardner Mark I.
Gilmer Mark C.
Advanced Micro Devices
Bowers Charles
Hawranek Scott J.
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