Semiconductor device having a flip-chip structure

Details Semiconductor device having a flip-chip structure Semiconductor device having a flip-chip structure

1998-06-26

2000-04-18

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257776, 257775, 257618, 257619, 257622, 257623, 361760, H01L 2348

Patent

active

060518898

ABSTRACT:
A semiconductor device includes a substrate having a first principal surface carrying thereon a first wiring pattern and a semiconductor chip having a second principal surface carrying a second wiring pattern thereon. The semiconductor chip is disposed on the substrate such that said second principal surface faces the first principal surface and a conductor is used for connecting the first wiring pattern and the second wiring pattern electrically and mechanically. The second wiring pattern includes a power conductor pattern, wherein a distance between the first principal surface and the second principal surface is increased selectively in correspondence to a part of the second principal surface on which the power conductor pattern is provided.

REFERENCES:
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5744857 (1998-04-01), Yamamoto

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