Semiconductor device having a flat jumper lead

Details Semiconductor device having a flat jumper lead Semiconductor device having a flat jumper lead

1993-11-29

1995-02-14

Wojciechowicz, Edward

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, H01L 2948, H01L 2944, H01L 2952, H01L 2960

Patent

active

053898176

ABSTRACT:
A plastic package type semiconductor device comprises: a die pad consisting of a plurality of parts; a tab lead consisting of a plurality of parts holding the die pad; a flat type Jumper lead formed between the parts of the die pad; an electrical insulating type insulating film formed on the die pad; a semiconductor chip bonded on the insulating film by an adhesive; and a plastic mold as a plastic package for molding the die pad, the tab lead, the flat type Jumper lead, the insulating file, and the semiconductor device in the plastic mold, whereby the semiconductor chip is Insulated electrically from the die pad. In addition, a SOJ plastic package type semiconductor device has a configuration without the Jumper lead described above.

REFERENCES:
patent: 4595945 (1986-06-01), Graver
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 4989068 (1991-01-01), Yasuhara et al.
patent: 5068708 (1991-11-01), Newman
patent: 5089879 (1992-02-01), Komenaka
patent: 5122858 (1992-06-01), Mahulikar et al.
patent: 5126821 (1992-06-01), Okinaga et al.
W. C. Ward, "Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ns 1-Mbit DRAM Chip by Area Wire Bond Techniques," May 9, 1988, pp. 552-557.

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