Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2002-01-03
2004-08-31
Nhu, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S314000
Reexamination Certificate
active
06784476
ABSTRACT:
This application relies for priority upon Korean Patent Application No. 2001-04588, filed on Jan. 31, 2001, the contents of which are herein incorporated by reference in their entirety.
FIELD OF THE INVENTION
The present invention relates to semiconductor memory devices in general, and more particularly to flash memory cells having select gates and fabrication methods thereof.
BACKGROUND OF THE INVENTION
A flash memory device is an advanced type of non-volatile memory device which can be erased electrically at a high speed without being removed from the circuit board as well as which retains information stored in its memory cells even when no power is supplied. Continuous improvements in flash memory technology had been made with different cell structures, which include stacked gate cells, split gate cells, source side injection cells and other types of cells, as described in U.S. Pat. No. 5,455,792 issued Oct. 3, 1995 to Yong-Wan Yi.
The stacked gate cell has floating gate and control gate electrodes, which are sequentially stacked. One example of the stacked gate cells is a cell proposed by Mukherjee et al. in U.S. Pat. No. 4,698,787 issued Oct. 6, 1987. The Mukherjee cell is shown in FIG.
1
. The cell is formed on a substrate
101
and employs channel hot electron injection for programming of the cell at a drain
104
side and the Fowler-Nordheim (F-N) tunneling for erasing at a source
102
side. This stacked gate cell has been prevalently adopted as a unit cell of a number of flash memory devices with an advantage of its small cell size. Other recent examples of the stacked gate cells are disclosed by H. Watanabe et al. in 1998 IEDM Technical Digest, p. 975 in an article entitled “Novel 0.44 um
2
Ti-salicide STI cell technology for high-density NOR flash memories and high performance embedded application” and in a Korean Patent Laid-open Publication No.
99-48775.
However, the stacked gate cell has a major disadvantage referred to as an over-erase problem. The over-erase problem occurs in stacked gate cells when the floating gate
110
in
FIG. 1
is overly discharged during the erase operation. The threshold voltages of over-erased cells are negative and such cells conduct current even when they are not selected by a read voltage applied to the control gate
112
.
In order to solve the over-erase problem, two different types of cells have been introduced, including a two-transistor cell structure, disclosed by Perlegos in U.S. Pat. No. 4,558,344 issued Dec. 10, 1985, and a split gate cell disclosed by Samachisa et al. in U.S. Pat. No. 4,783,766 issued Nov. 8, 1988. Perlegos employs a select transistor. A select gate in the Periegos cell blocks the leakage current from an over-erased floating gate when the cell is not selected. Similarly, the split gate cell of Samachisa et al. solved the problem by introducing a select gate portion of a channel under a control gate. The select gate portion has the function of blocking the leakage current coming from the floating gate portion of channel under an over-erased floating gate, when the control gate is turned off.
The major drawback of a split gate cell is low programming efficiency. Split gate cells are programmed by the conventional channel hot electron injection method, which has a very low programming efficiency. Such low injection efficiency unnecessarily wastes power and prohibits faster programming.
In order to improve the efficiency of hot electron injection to the floating gate, the source side injection (SSI) cell has been introduced by Wu et al. as disclosed in U.S. Pat. No. 4,794,565 issued Dec. 27, 1988 and Mar et al. as disclosed in U.S. Pat. No. 5,280,446 issued Jan. 18, 1994. The SSI cell of disclosed by Wu is formed on a substrate
201
having a source
202
and a drain
204
, as shown in
FIG. 2. A
select gate
206
, often called a sidewall gate, is positioned at the source side of the conventional stacked gate structure in order to induce the hot electron injection from the source
202
to a floating gate
210
when a high voltage is applied to a control gate
212
. It was reported that drastic improvements of program efficiency were realized, in hot electron injections of the source side injection cell on the order of 1,000 to 10,000 times more efficient, as compared to the conventional channel hot electron injection.
Meanwhile, a new non-volatile memory cell was introduced which has a MONOS (Metal-Oxide-Nitride-Oxide-Semiconductor) structure to reduce program voltage. The MONOS cell includes a thin dielectric layer composed of a lower silicon oxide layer (a tunnel oxide layer), a silicon nitride layer, and an upper silicon oxide layer (a top oxide layer). The thin dielectric layer is interposed between a semiconductor substrate and a control gate. The MONOS cell has state of a logic “0” when electrons are trapped in the silicon nitride layer. The MONOS cell has the other stage of a logic “1” when electrons are not trapped in the silicon nitride layer. An example of a MONOS cell is described in U.S. Pat. No. 5,930,631 issued Jul. 27, 1999 to Chih-Hsien Wang et al. As shown in
FIG. 3
, the Wang cell has a source
402
, a drain
404
and a channel therebetween in a substrate
401
. A select gate
406
is formed on the substrate
401
. An ONO (oxide
itride/oxide) layer
420
is formed on the select gate
406
and the substrate
401
. A control gate
408
is formed on the ONO layer
420
. A lightly doped drain (LDD) structure is adapted to the drain for the purpose of reducing hot carriers near the drain junction. In the programming mode, hot carriers tunnel to the ONO layer
420
and are trapped in the nitride layer. In order to accomplish this, the control gate
408
, the select gate
406
and the drain
404
are positively biased while the source
402
is ground. In the erase mode, carriers tunnel from the ONO layer
420
to the drain
404
. In the erasure mode, the drain
404
is at a high voltage while the select gate
406
is off. The select gate
406
serves to conserve power because the device is erased without causing current to flow through the channel of the device.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a non-volatile memory device having a minimized cell size and low power consumption during a program operation.
Another object of the present invention is to provide a method for forming a non-volatile memory device having a minimized cell size and low power consumption during a program operation.
According to one aspect of the invention, a non-volatile memory device comprises a substrate, a charge storage region stacked on the substrate, a control gate stacked on the charge storage region and a gate mask stacked on the control gate. The gate mask has a spacer-shape.
According to another aspect of the invention, a non-volatile memory device comprises a substrate having a source and a drain. The substrate also has a channel between the source and the drain. A charge storage region is formed on the channel, and a control gate is formed on the charge storage region. A select gate is formed on the channel and between charge storage region and the drain. The charge storage region, the channel, the drain, the control gate and the select gate constitute a first unit cell.
According to another aspect of the invention, a method for forming a non-volatile memory device comprises forming a charge storage layer on a substrate and forming a control gate layer on the charge storage layer. A gate mask having a spacer-shape is formed on the control gate layer. The charge storage layer and the control gate layer are partially removed. During the removal process, the gate mask protects a portion of the charge storage layer and the control gate layer to form a control gate and a charge storage region.
In a preferred embodiment, a select gate is formed on the substrate and a sidewall of the charge storage region, and a conductive region is formed on the substrate adjacent another sidewall of the charge storage region. The charge storage region, the control gate, the gate mask
Cho Min-Soo
Kim Dong-Jun
Kim Jin-Ho
Lee Yong-Kyu
Ryu Eui-Youl
Mills & Onello LLP
Nhu David
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