Semiconductor device having a film-covered packaged component

Details Semiconductor device having a film-covered packaged component Semiconductor device having a film-covered packaged component

1991-01-14

1993-05-04

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257790, 361421, 174 524, H01L 2348, H01L 2946

Patent

active

052084671

ABSTRACT:
A semiconductor device comprising a lead frame, a semiconductor chip on the lead frame, a wiring provided between the lead frame and the semiconductor chip, a silicon nitride film formed on the semiconductor chip, the wire, and the lead frame, and a mold formed from a plastic material to enclose the silicon nitride film therein and having a vent hole formed on the undersurface of the lead frame, so that the lead frame is partly exposed to the outside.

REFERENCES:
patent: 3644801 (1972-02-01), Sheldon
patent: 4001872 (1977-01-01), Khajezadeh
patent: 4024570 (1977-05-01), Hartmann et al.
patent: 4486945 (1984-12-01), Aigoo
patent: 4723197 (1988-02-01), Takiar et al.
patent: 4777520 (1988-10-01), Nambu et al.
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4845543 (1989-07-01), Okikawa et al.
patent: 4866506 (1989-09-01), Nambu et al.
patent: 5057900 (1991-10-01), Yamazaki

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