Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-02
2007-01-02
Pham, Hoai (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S637000
Reexamination Certificate
active
10842139
ABSTRACT:
The present invention provides a semiconductor device, a method of manufacture therefor, and an integrated circuit including the same. In one aspect, the present invention provides a semiconductor device having a dielectric layer located over a conductive feature and a conductive via located within the dielectric layer and contacting the conductive feature. The semiconductor device, among other elements, may further include a dummy conductive via located proximate the conductive via and contacting the conductive feature. One of the intents of the dummy conductive via is to attempt to trap vacancies associated with the conductive feature or the conductive via.
REFERENCES:
patent: 5755903 (1998-05-01), Garant et al.
patent: 6232662 (2001-05-01), Saran
patent: 6346475 (2002-02-01), Suzuki et al.
patent: 6468894 (2002-10-01), Yang et al.
patent: 6492259 (2002-12-01), Dirahoui et al.
patent: 6573538 (2003-06-01), Motsiff et al.
patent: 6624063 (2003-09-01), Hasegawa et al.
patent: 6984579 (2006-01-01), Nguyen et al.
patent: 11154679 (1999-06-01), None
Agere Systems Inc.
Hafiz Mursalin B.
Pham Hoai
LandOfFree
Semiconductor device having a dummy conductive via and a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device having a dummy conductive via and a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device having a dummy conductive via and a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3767674