Semiconductor device having a bi-level leadframe

Details Semiconductor device having a bi-level leadframe Semiconductor device having a bi-level leadframe

1992-12-10

1994-05-10

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257668, 257670, 257672, 257692, 257698, 257734, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

053110560

ABSTRACT:
A lead frame for a semiconductor device includes a resin base film having opposed surfaces and an opening therein. A plurality of inner leads are formed of a metal foil on one surface of the film in a desired inner lead circuit pattern that includes inner edges arranged for connection to a semiconductor device mounted on the film and outer edges positioned over the opening. A plurality of outer leads are formed of a metal sheet and adhered to the other surface of the film in a desired outer lead circuit pattern that includes inner edges positioned over the opening and outer edges that extend outwardly from the frame.

REFERENCES:
patent: 4571354 (1986-02-01), Maxwell
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4874086 (1989-10-01), Imamura et al.
patent: 4937656 (1990-06-01), Kohara
patent: 4967260 (1990-10-01), Butt
patent: 4987475 (1991-01-01), Schlesinger et al.

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