Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Patent
1994-07-29
1996-01-09
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
257782, 257792, 257795, H01L 2348, H01L 2329, H01L 2350
Patent
active
054831067
ABSTRACT:
In fixing a sensor element for sensing stress on a substrate by using an adhesive for semiconductors, the present invention aims to solve both the problems of stress applied from the substrate side due to temperature change and defects in wire bonding in the wire bonding process. In a semiconductor device equipped with a sensor element for sensing stress fixed on a substrate, an adhesive for semiconductors is used which is prepared by compounding resin beads made of resin with a base adhesive made of flexible resin.
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Journal of Nippondenso Technical Disclosure 75-107, 1990.
Echigo Masashi
Kitano Masahiko
Maeda Takushi
Nagayama Yoshitaka
Yamada Toshitaka
Nippondenso Co. Ltd.
Saadat Mahshid
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