Semiconductor device for fingerprint recognition

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

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C257S433000, C257S434000, C257S704000, C257S774000, C257SE23002

Reexamination Certificate

active

07989938

ABSTRACT:
A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

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Office Action Issued in JP 2003-097095 mailed Apr. 22, 2008.

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