Semiconductor device for face down bonding to a mounting substra

Details Semiconductor device for face down bonding to a mounting substra Semiconductor device for face down bonding to a mounting substra

1997-02-26

1999-07-20

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257790, 257778, 257737, 257738, 257788, H01L 2348, H01L 2329

Patent

active

059259361

ABSTRACT:
Resin meltable at a time of reflowing is provided on the surface of a semiconductor chip and top ends of the connection electrodes are located parallel with the surface of the resin. A semiconductor chip is mounted on a mounting substrate and, upon reflowing, the resin is molten to allow the semiconductive chip to be bonded to the mounting substrate and encapsulate a resultant structure.

REFERENCES:
patent: 5600180 (1997-02-01), Kusaka et al.
patent: 5757078 (1998-05-01), Matsuda et al.

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