Semiconductor device, flexible substrate, tape carrier, and...

Details Semiconductor device, flexible substrate, tape carrier, and... Semiconductor device, flexible substrate, tape carrier, and...

2008-05-06

2008-05-06

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

C257S676000, C257S693000, C257S762000, C257SE23065, C257SE23177

Reexamination Certificate

active

11229786

ABSTRACT:
In the semiconductor device of the present invention, there are provided output terminals on two sides perpendicular to one of four sides which is nearest output outer leads of a liquid crystal driver chip mounted to a flexible substrate. The wires extending from the inner leads connected to the output terminals to the output outer leads do not need to travel around a liquid crystal driver chip. The flexible substrate can be scaled down. Yields can be increased.

REFERENCES:
patent: 5680191 (1997-10-01), Voisin et al.
patent: 2001/0009299 (2001-07-01), Saito
patent: 2002/0109814 (2002-08-01), Murahashi et al.
patent: 1-236637 (1989-09-01), None
“Industry-leading fine pitch mount technology Sharp establishes high density multichip/system on film (SOF) mass production technology Multiple LSI chips mounted on single flexible board, allowing system integration Thickness reduced by more than half” by Sharp Kabushiki Kaisha, “News Release from Sharp Kabushiki Kaisha No. 2001-103”, Published Dec. 11, 2001.

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