Semiconductor device, electrical inspection method thereof,...

Details Semiconductor device, electrical inspection method thereof,... Semiconductor device, electrical inspection method thereof,...

2006-10-17

2006-10-17

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S516000, C257S528000, C257S532000, C257S308000, C257S312000, C257S522000, C257S724000, C257S924000, C257SE29218, C257SE23057

Reexamination Certificate

active

07122888

ABSTRACT:
A semiconductor device is arranged so as to include (i) a wire L1, connected directly to an LSI chip, which serves as a VGL wire for supplying a voltage VGL to the LSI chip, and (ii) a wire LB1connected not directly to but to one of a pair of electrodes of a capacitor provided between the wire LB1and a voltage VGH wire, each of the wire L1and the wire LB1including a voltage input terminal. This arrangement provides (i) a semiconductor device, including a built-in capacitor, which makes it possible to shorten time required in an electrical screening test (final test) so as to reduce cost, and (ii) an electrical inspection method of the semiconductor device.

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patent: 07-161923 (1995-06-01), None

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