Semiconductor device connector, semiconductor device...

Details Semiconductor device connector, semiconductor device... Semiconductor device connector, semiconductor device...

2007-09-25

2007-09-25

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S718000, C257S719000, C257S731000, C257S733000, C257S737000, C257S738000, C257SE23001, C257SE23033, C257SE23063, C257SE23145

Reexamination Certificate

active

11315482

ABSTRACT:
A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.

REFERENCES:
patent: 2006/0071331 (2006-04-01), Kuroda et al.
patent: 5-028037 (1993-04-01), None
patent: 2004-047186 (2004-02-01), None

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