Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2011-04-26
2011-04-26
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
C257S700000, C257S687000, C257S777000
Reexamination Certificate
active
07932517
ABSTRACT:
A semiconductor device includes a first circuit substrate having a plurality of lower wiring lines and a plurality of upper wiring lines on the lower surface side and upper surface side thereof, respectively. A second circuit substrate is provided on a lower side of the first circuit substrate, the second circuit substrate having an opening which exposes part of the first circuit substrate, the second circuit substrate also having, on the lower surface side thereof, a plurality of external-connection connection pads and a plurality of test connection pads connected to the lower wiring lines. A first semiconductor construct is disposed on the lower side of the first circuit substrate within the opening of the second circuit substrate, the first semiconductor construct having a plurality of external connection electrodes connected to the lower wiring lines. A third circuit substrate and/or an electronic component is provided on an upper side of the first circuit substrate and connected to the upper wiring lines.
REFERENCES:
patent: 5986460 (1999-11-01), Kawakami
patent: 6060778 (2000-05-01), Jeong et al.
patent: 6288346 (2001-09-01), Ojiri et al.
patent: 7087988 (2006-08-01), Hosomi
patent: 7151010 (2006-12-01), Nguyen et al.
patent: 2002/0158318 (2002-10-01), Chen
patent: 2006/0090931 (2006-05-01), Hashimoto
patent: 2006/0103003 (2006-05-01), Heide et al.
patent: 2006/0226527 (2006-10-01), Hatano et al.
patent: 2007/0138619 (2007-06-01), Shinagawa et al.
patent: 2008/0239686 (2008-10-01), Negishi
patent: 11-17057 (1999-01-01), None
patent: 2004-22664 (2004-01-01), None
patent: 2004-64043 (2004-02-01), None
patent: 2004-207306 (2004-07-01), None
patent: 2004-281633 (2004-10-01), None
patent: WO 2005/071743 (2005-08-01), None
The International Search Report and the Written Opinion of the International Searching Authority dated Aug. 22, 2008, issued in a counterpart International Application. 16 sheets.
Chinese Office Action dated Jun. 2, 2010 and English translation thereof, issued in counterpart Chinese Application No. 200880004282.5.
Japanese Office Action dated Sep. 7, 2010 (and English translation thereof) in counterpart Japanese Application No. 2007-087662.
Casio Computer Co. Ltd.
Holtz Holtz Goodman & Chick PC
Louie Wai-Sing
Tang Sue
LandOfFree
Semiconductor device comprising circuit substrate with... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device comprising circuit substrate with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device comprising circuit substrate with... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2689729