Semiconductor device, base member for semiconductor device and s

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

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Details

257692, 257702, 257783, H01L 2302

Patent

active

057478740

ABSTRACT:
A semiconductor device includes a semiconductor element, a semiconductor device base member having an element mounting portion on which the semiconductor element is mounted, external connection terminals provided on the semiconductor device base member and electrically connected to the semiconductor element, and a resin sealing the semiconductor element. The semiconductor device base member includes a base part and lead parts supported by the base part. The lead parts are electrically connected to the external connection terminals. The semiconductor device base member has bent portions in which the lead parts are located on outer sides of the semiconductor device base member. The bent portions are located in edge portions of the semiconductor device base member.

REFERENCES:
patent: 4635093 (1987-01-01), Ross
patent: 4682270 (1987-07-01), Whitehead et al.
patent: 4691225 (1987-09-01), Myrakami et al.
patent: 4864470 (1989-09-01), Nishio
patent: 5311402 (1994-05-01), Kobayashi et al.

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