Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-08-16
2011-08-16
Toledo, Fernando L (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C430S108200, C430S109500, C257SE21705, C257SE25013
Reexamination Certificate
active
07998792
ABSTRACT:
A semiconductor device is formed of two or more dice of similar dimensions and bond pad arrangements, in which bond pads are located in fields along less than three edges of the active surface of each die. A first die is attached to a substrate and subsequent die or dice are attached in a vertical sequence atop the first die, each in an offset configuration from the next lower die to expose the bond pads thereof for conductive bonding to metallization of the substrate. The multiple chip device permits a plurality of dice to be stacked in a high-density low-profile device. A particularly useful application is the formation of stacked mass storage flash memory package.
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Brooks Jerry M.
Corisis David J.
Mess Leonard E.
Lerner David Littenberg Krumholz & Mentlik LLP
Round Rock Research, LLC
Toledo Fernando L
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