Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2011-01-04
2011-01-04
Lee, Eugene (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S531000, C257S533000, C257S528000, C257S536000, C257SE27016
Reexamination Certificate
active
07863736
ABSTRACT:
A semiconductor device may include a semiconductor chip including a signal terminating resistor coupled between a signal input pad and a first ground voltage pad, a semiconductor package including a signal input terminal and a first ground voltage terminal, the signal input terminal being electrically coupled to the signal input pad of the semiconductor chip and the first ground voltage terminal being electrically coupled to the first ground voltage pad of the semiconductor chip, a capacitor and a resistor that are coupled between the signal input terminal and the first ground voltage terminal, and a first inductor realized by coupling the signal input terminal and the signal input pad.
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Lee Eugene
Lee & Morse P.C.
Samsung Electronics Co,. Ltd.
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