Semiconductor device and semiconductor module having auxiliary h

Details Semiconductor device and semiconductor module having auxiliary h Semiconductor device and semiconductor module having auxiliary h

1992-09-24

1994-04-26

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257691, 257693, 361767, 361772, H01L 2302, H01L 2312

Patent

active

053069480

ABSTRACT:
Herein disclosed is a chip-carrier type semiconductor device adopting the MCC structure, in which a semiconductor pellet is mounted on the surface of the base substrate and in which mounting terminals to be connected with external terminals of the semiconductor pellet are mounted on the rear surface of the base substrate. In order to effect a test such as screening easily and inexpensively even if the mounting terminals are multiplied or miniaturized, the chip-carrier type semiconductor device adopting the MCC structure is equipped on the side surfaces of the base substrate with auxiliary terminals to be electrically connected with a plurality of external terminals which are arrayed on an element formed main surface of the semiconductor pellet.

REFERENCES:
patent: 3815077 (1974-07-01), Anhalt et al.
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4458917 (1984-07-01), Yanagisawa et al.
patent: 4530002 (1985-07-01), Kanai
patent: 4635093 (1987-01-01), Ross
patent: 5041899 (1991-08-01), Oku et al.

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