Semiconductor device and resin for sealing a semiconductor devic

Details Semiconductor device and resin for sealing a semiconductor devic Semiconductor device and resin for sealing a semiconductor devic

1995-03-17

1996-07-23

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

257789, 257795, H01L 2329

Patent

active

055392180

ABSTRACT:
There is disclosed a semiconductor device wherein electrode terminals (2), elements (6) and wires (7) are disposed on a base plate (5) of a case (4) filled with only epoxy resin (1). The epoxy resin (1) contains impurities such as halogen and alkaline metallic salts in an amount of not more than 5 ppm and has a linear expansion coefficient of 5.times.10.sup.-6 to 25.times.10.sup.-6 when hardened. The semiconductor device provides for direct sealing of the components, whereby its size and cost are reduced.

REFERENCES:
patent: 4043969 (1977-08-01), Sporck
patent: 5298548 (1994-03-01), Shiobara et al.
Microelectronics Packaging Handbook, pp. 555-564, 1989, "Encapsulation Materials", Rao R. Tummala, et al.
Patent Abstracts of Germany, AN-68-18434Q/00, DE-1-694700, Oct. 1, 1970.

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