Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2009-06-24
2010-11-16
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257SE23123, C257S686000, C438S124000
Reexamination Certificate
active
07834470
ABSTRACT:
The present invention include a semiconductor device and a method therefore, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefore, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
REFERENCES:
patent: 6582991 (2003-06-01), Maeda et al.
patent: 7051169 (2006-05-01), Ganton
patent: 7312785 (2007-12-01), Tsuk et al.
patent: 7372137 (2008-05-01), Saeki
patent: 2007/0194412 (2007-08-01), Nakagawa et al.
patent: 2001-7259 (2001-01-01), None
patent: 2003-080537 (2003-03-01), None
patent: 2003-258162 (2003-09-01), None
patent: 2005-101356 (2005-04-01), None
patent: 2005-157736 (2005-06-01), None
Meguro Kouichi
Onodera Masanori
Tanaka Junji
Taya Koji
Pert Evan
Soderholm Krista
Spansion LLC
LandOfFree
Semiconductor device and programming method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and programming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and programming method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4236397