Semiconductor device and production method thereof

Details Semiconductor device and production method thereof Semiconductor device and production method thereof

1995-08-28

1997-09-16

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

On insulating carrier other than a printed circuit board

257688, 257669, H01L 23495, H01L 2348

Patent

active

056684045

ABSTRACT:
A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.

REFERENCES:
patent: 3868724 (1975-02-01), Perrino
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4573067 (1986-02-01), Tuckerman et al.
patent: 4721995 (1988-01-01), Tanizawa
patent: 5157478 (1992-10-01), Ueda et al.
patent: 5349239 (1994-09-01), Sayka et al.
IBM Technical Disclosure Bulletin, "Integrated Circuits Chip Cooling" J.B. Pearson, vol. 19, No. 2 Jul./1976, pp. 460-461.

Affiliated with

Also associated with

Rating

Semiconductor device and production method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and production method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and production method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-220623