Semiconductor device and process for producing the same

Details Semiconductor device and process for producing the same Semiconductor device and process for producing the same

1981-12-04

1989-02-07

James, Andrew J.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

357 79, 357 80, 156330, H01L 2328, H01L 3902

Patent

active

048035432

ABSTRACT:
In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.

REFERENCES:
patent: 3600246 (1971-08-01), Breen
patent: 3811183 (1974-05-01), Celling
patent: 3849187 (1974-11-01), Fetscher et al.
patent: 3975757 (1976-08-01), Sporck
patent: 4076869 (1978-02-01), Flynn
patent: 4210704 (1980-07-01), Chandross et al.
patent: 4248920 (1981-02-01), Yoshizumi et al.
patent: 4297401 (1981-10-01), Chern et al.
patent: 4298883 (1981-11-01), Komatsu et al.
patent: 4356505 (1982-10-01), Lovinger
Encyclopedia of Polymer Science and Tech. vol. 10, p. 51, Wiley N.Y. 1969, p. 92.
Handbook of Epoxy Resins, Lee et al., McGraw-Hill 1967, Chapter 11, p. 15.

Affiliated with

Also associated with

Rating

Semiconductor device and process for producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and process for producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and process for producing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1088022