Semiconductor device and process for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE27006

Reexamination Certificate

active

07898036

ABSTRACT:
A semiconductor device includes a semiconductor substrate; a gate electrode formed on the semiconductor substrate; source and drain extension regions formed in the semiconductor substrate on a first and a second side corresponding to a first sidewall surface and a second sidewall surface, respectively, of the gate electrode; a first piezoelectric material pattern formed on the semiconductor substrate continuously covering the first sidewall surface of the gate electrode from the first side of the gate electrode; a second piezoelectric material pattern formed on the semiconductor substrate continuously covering the second sidewall surface of the gate electrode from the second side of the gate electrode; and source and drain regions formed in the semiconductor substrate outside the source extension region and the drain extension, respectively.

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K. Ota et al; “Stress Controlled Shallow Trench Isolation Technology to Suppress the Novel Anti-Isotropic Impurity Diffusion for 45nm-node High-Performance CMOSFETs,” 2005 Symposium on VLSI Technology Digest of Technical Papers; pp. 138-139.
S. Pidin et al; “A Novel Strain Enhanced CMOS Architecture Using Selectively Deposited High Tensile and High Compressive Silicon Nitride Films,” IEDM Tech. Dig; p. 213; 2004.
International Search Report of PCT/JP2006/303388, date of mailing Jun. 6, 2006.

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