Semiconductor device and process for manufacturing the same

Details Semiconductor device and process for manufacturing the same Semiconductor device and process for manufacturing the same

2007-09-11

2007-09-11

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S669000, C257SE23021, C257SE23069, C257SE23145, C439S066000

Reexamination Certificate

active

11213882

ABSTRACT:
The present invention relates to a semiconductor device in which electrodes formed on a semiconductor chip and electrodes formed on a wiring board are electrically connected via projecting elastic electrodes, and further relates to a mounting method of reducing a pressure applied to electrodes formed on a substrate or underlying wirings when a semiconductor chip and a wiring board are bonded.

REFERENCES:
patent: 4893172 (1990-01-01), Matsumoto et al.
patent: 5897326 (1999-04-01), Eldridge et al.
patent: 5983493 (1999-11-01), Eldridge et al.
patent: 6307159 (2001-10-01), Soejima et al.
patent: 6716037 (2004-04-01), Kung et al.
patent: 7127811 (2006-10-01), Mathieu et al.
patent: 2001/0021596 (2001-09-01), Tamura
patent: 2004/0000428 (2004-01-01), Lii et al.
patent: 08-139226 (1996-05-01), None
patent: 2791429 (1998-04-01), None
patent: 10-173006 (1998-06-01), None
patent: 10-303345 (1998-11-01), None
patent: 11-145172 (1999-05-01), None
patent: 11-214447 (1999-06-01), None
patent: 11-233669 (1999-08-01), None
patent: 2968051 (1999-08-01), None
patent: 2000-174165 (2000-06-01), None
patent: 2000-320148 (2000-11-01), None
patent: 2001-050980 (2001-02-01), None
patent: 2001-156091 (2001-06-01), None
patent: 2001-351892 (2001-12-01), None
patent: WO 97/16866 (1997-05-01), None
Taiwanese Office Action issued in corresponding Taiwan Patent Application, dated Dec. 27, 2006.

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