Semiconductor device and process and leadframe for making the sa

Details Semiconductor device and process and leadframe for making the sa Semiconductor device and process and leadframe for making the sa

1995-11-06

1998-10-13

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

257676, 257666, 257735, H01L 23495

Patent

active

058216111

ABSTRACT:
A semiconductor device which comprises a first lead having a tip formed with an island, a semiconductor chip unit mounted on the island of the first lead by means of a solder layer and having a plurality of electrode bumps projecting away from the island, and a plurality of additional leads each of which has a tip electrically connected to the electrode bumps via respective solder deposits. The additional leads include at least second and third leads. The tips of the second and third leads are at least partially wider than the semiconductor chip.

REFERENCES:
patent: 3348105 (1967-10-01), Doyle
patent: 4189342 (1980-02-01), Kock
patent: 4616250 (1986-10-01), Folk
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 5038453 (1991-08-01), Kurita et al.
patent: 5218231 (1993-06-01), Kudo

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