Semiconductor device and package structure therefore and power i

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – By pressure alone

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257147, 257150, 257151, 257152, H01L 2348

Patent

active

056524676

ABSTRACT:
An auxiliary cathode lead is contacted to a cathode buffer electrode which contacts to an unit GTO arranged at the most remote region from a gate pressure contacting portion of a GTO pellet and the push-into effect of the auxiliary cathode current during the turn-off can be remarkably performed. Without inviting bad affects such as the increase in "on" voltage, it is proposed a package structure of a semiconductor which the unit GTO arranged remote from a gate is easily to perform the turn-off. The maximum turn-off current can be heightened, it can easily correspond to the increase in the diameter of the pellet according to the large current of the unit element. Further, a condenser of a snubber circuit as a protection circuit of the unit GTO in a power inverter can be small, and the snubber loss can be lessened.

REFERENCES:
patent: 4374393 (1983-02-01), Kamahara
patent: 4953004 (1990-08-01), Almenrader et al.
patent: 4996586 (1991-02-01), Matsuda et al.
patent: 5198882 (1993-03-01), Matsuda et al.

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