Semiconductor device and method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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Details

257750, 257758, H01L 2348, H01L 2352, H01L 2940

Patent

active

061539376

ABSTRACT:
An object of the present invention is to provide a semiconductor device where a metal wiring pattern is improved in order to prevent photoresist foaming from occurring without employing a special process, even if a protective layer void occur in a wire to wire space in the metal wire, and an arrangement method for a semiconductor device pattern. To achieve the above object, the present invention provides a semiconductor device comprising a first wiring layer and a second wiring layer arranged in a row on a semiconductor substrate, and a insulating layer on the first wiring layer and the second wiring layer so that a first portion of the insulating layer on the first wiring layer is prevented from touching a second portion of the insulating layer on the second wiring layer.

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