Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1995-09-08

1997-04-29

Ledynh, Bot L

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257676, 257692, 257787, 361728, 361813, 29854, 29855, 29841, 29848, H01L 2302, H01L 2308, H01L 4300

Patent

active

RE0354961

ABSTRACT:
A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms pan of a resin package.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5068712 (1991-11-01), Murakami et al.
patent: 5155578 (1992-10-01), Lim et al.
IBM Technical Disclosure Bulletin, vol. 34 No. 1 Jun. 1991, pp. 358-359.

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