Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

2007-08-16

2010-06-22

Vu, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With bumps on ends of lead fingers to connect to semiconductor

C257SE23023, C438S613000

Reexamination Certificate

active

07741705

ABSTRACT:
A semiconductor device includes a semiconductor substrate having an internal circuit; an electrode pad electrically connected to the internal circuit; an insulating film having a through hole exposing the electrode pad; and a re-distribution wiring pattern formed on the insulating film and electrically connected to the electrode pad. The semiconductor device further includes a recess groove formed in the insulating film around and adjacent to the re-distribution wiring pattern.

REFERENCES:
patent: 6835595 (2004-12-01), Suzuki et al.
patent: 7253519 (2007-08-01), Huang et al.
patent: 2004/0150104 (2004-08-01), Terui
patent: 06-84886 (1994-03-01), None
patent: 2000-22217 (2000-01-01), None
patent: 2003-060120 (2003-02-01), None

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