Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1992-10-28

1994-08-02

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257676, 257692, 257787, 361728, 29854, 29855, H01L 2302, H01L 2328, H01R 4300

Patent

active

053348036

ABSTRACT:
A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms part of a resin package.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5068712 (1991-11-01), Murakami
patent: 5155578 (1992-10-01), Lim
IBM Technical Disclosure Bulletin vol. 34 No. 1 Jun. 1991, pp. 358-359.

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