Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1999-04-27

2000-08-15

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257666, 257672, 257673, 257780, 257783, 257784, 257675, H01L 23495

Patent

active

061040851

ABSTRACT:
A QFP adapted to lowering the heat resistance and increasing the number of pins, and a method of producing the same. The QFP includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a semiconductor chip mounted on the heat-radiating metal plate, leads provided on the heat-radiating metal plate and surrounding the peripheries of the semiconductor chip, bonding wires for connecting the leads to the semiconductor chip, and a sealing resin member for sealing part of the semiconductor chip, inner leads of the leads, bonding wires and part of the heat-radiating metal plate. The tips of the bumpers integrally formed with the heat-radiating metal plate are positioned outside the tips of the outer leads that are protruding from the sealing resin member. In the QFP producing method, the heat-radiating metal plate having the bumpers and the lead frame having the leads are secured outside the sealing resin member.

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"Flat Package using three-layer film", IBM Technical Disclosure Bulletin, vol. 31, No. 8, Jan. 1989.

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