Semiconductor device and method of producing the same

Details Semiconductor device and method of producing the same Semiconductor device and method of producing the same

1997-05-13

1998-09-08

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438124, 438126, 438127, 29841, 29855, H01L 2144, H01L 2148, H01L 2150

Patent

active

058044671

ABSTRACT:
A semiconductor device includes a substrate having top and bottom surfaces, a semiconductor element mounted on the top surface of the substrate, and a resin package made of a resin and encapsulating the semiconductor element. The substrate includes at least one resin gate hole enabling the resin to be introduced from the bottom surface of the substrate via the resin gate hole when encapsulating the semiconductor element by the resin.

REFERENCES:
patent: 5200366 (1993-04-01), Yamada et al.
patent: 5311059 (1994-05-01), Banerii et al.
patent: 5385869 (1995-01-01), Liu et al.
patent: 5394009 (1995-02-01), Loo
patent: 5455456 (1995-10-01), Newman
IBM Technical Disclosure Bulletin, vol. 22, #9, Feb. 1980, NY, USA, p. 3988 .

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