Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – On insulating substrate or layer
Reexamination Certificate
2008-04-22
2011-10-11
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
On insulating substrate or layer
C438S289000, C438S258000
Reexamination Certificate
active
08034695
ABSTRACT:
A method of manufacturing a semiconductor device comprising the steps of: forming a first silicon oxide film which covers a first region on the top surface of a silicon substrate, but which does not cover a second region and a third region thereon; oxidizing the silicon substrate to thicken the first silicon oxide film formed on the first region, and to form a second silicon oxide film on the second region and the third region; forming a first silicon film which covers the first region and the second region, but which does not cover the third region; etching and removing the second silicon oxide film formed on the third region by using the first silicon film as a mask; and forming a third silicon oxide film on the third region, the third silicon oxide film being thinner than the second silicon oxide film.
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Suwa Yoshito
Takebuchi Masataka
Kabushiki Kaisha Toshiba
Menz Laura M
Turocy & Watson LLP
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