Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S360000, C257SE27016, C257S379000

Reexamination Certificate

active

08080852

ABSTRACT:
The semiconductor device includes a first MIS transistor including a gate insulating film92, a gate electrode108formed on the gate insulating film92and source/drain regions154, a second MIS transistor including a gate insulating film96thicker than the gate insulating film92, a gate electrode108formed on the gate insulating film96, source/drain regions154and a ballast resistor120connected to one of the source/drain regions154, a salicide block insulating film146formed on the ballast resistor120with an insulating film92thinner than the gate insulating film96interposed therebetween, and a silicide film156formed on the source/drain regions154.

REFERENCES:
patent: 5239195 (1993-08-01), Compagne
patent: 5498892 (1996-03-01), Walker et al.
patent: 6100127 (2000-08-01), Wu
patent: 6111304 (2000-08-01), Sonoda
patent: 6646324 (2003-11-01), Dabral et al.
patent: 6891210 (2005-05-01), Akiyama
patent: 7119405 (2006-10-01), Chen et al.
patent: 2003/0081363 (2003-05-01), Kawashima et al.
patent: 2004/0004229 (2004-01-01), Akiyama
patent: 10-074894 (1998-03-01), None
patent: 2000-31295 (2000-01-01), None
patent: 2002-134630 (2002-05-01), None
patent: 2002134630 (2002-05-01), None
patent: 2003-133433 (2003-05-01), None
patent: 2004-039775 (2004-02-01), None
“Korean Office Action”, mailed by KPO and corresponding to Korean application No. 10-2010-7015979 on Oct. 15, 2010, with English translation.
International Search Report of PCT/JP2005/009348, date of mailing Aug. 23, 2005.
USPTO, (STOWE) Notice of Allowance and Notice of Allowability, Nov. 1, 2010, in U.S. Appl. No. 11/944,073 [now allowed].
USPTO, (STOWE) Final Rejection, Mar. 25, 2010, in U.S. Appl. No. 11/944,073 [now allowed].
USPTO, (STOWE) Non-Final Rejection, Aug. 27, 2009, in U.S. Appl. No. 11/944,073 [now allowed].
USPTO, (STOWE) Restriction Requirement, Jun. 18, 2009, in U.S. Appl. No. 11/944,073 [now allowed].
Japanese Office Action mailed Jul. 12, 2011 for corresponding Japanese Application No. 2007-517677 (in Japanese language).

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