Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2008-05-16
2010-06-15
Smith, Matthew (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S368000, C257SE29150, C257SE29139, C257SE27060
Reexamination Certificate
active
07737511
ABSTRACT:
There is provided a method of manufacturing a semiconductor device, including forming a structure including a first layer containing Si and a metal oxide layer in contact with the first layer, the metal oxide layer having a dielectric constant higher than that of silicon oxide, and heating the structure in an atmosphere containing He and/or Ne.
REFERENCES:
patent: 3852120 (1974-12-01), Johnson et al.
patent: 4282647 (1981-08-01), Richman
patent: 4317686 (1982-03-01), Anand et al.
patent: 4837172 (1989-06-01), Mizuno et al.
patent: 5998838 (1999-12-01), Tanabe et al.
patent: 6013553 (2000-01-01), Wallace et al.
patent: 6106734 (2000-08-01), Shindo et al.
patent: 6120597 (2000-09-01), Levy et al.
patent: 6208030 (2001-03-01), Tsui et al.
patent: 6352900 (2002-03-01), Mehrotra et al.
patent: 6465335 (2002-10-01), Kunikiyo
patent: 6486080 (2002-11-01), Chooi et al.
patent: 6552403 (2003-04-01), Lucovsky
patent: 6613658 (2003-09-01), Koyama et al.
patent: 6635517 (2003-10-01), Chen et al.
patent: 6693324 (2004-02-01), Maegawa et al.
patent: 6713819 (2004-03-01), En et al.
patent: 7422953 (2008-09-01), Muraoka et al.
patent: 2005/0054182 (2005-03-01), Wang
patent: 2005/0227463 (2005-10-01), Ito et al.
patent: 2005/0236626 (2005-10-01), Takafuji et al.
patent: 2008/0246094 (2008-10-01), Liaw et al.
patent: 3-46226 (1991-02-01), None
patent: 05-218355 (1993-08-01), None
patent: 10-209403 (1998-08-01), None
patent: 11-168212 (1999-06-01), None
patent: 2000-269483 (2000-09-01), None
patent: 2001-189312 (2001-07-01), None
patent: 2001-313292 (2001-11-01), None
patent: 2002-50624 (2002-02-01), None
J. P. Maria et al., High Temperature Stability in Lanthanum and Zirconia-based Gate Dielectrics,Journal of Applied Physics, vol. 90, No. 7, Oct. 1, 2001, pp. 3476-3482.
Heiji Watanabe, Interface Engineering of a ZrO2/SiO2/Si Layered Structure by in situ Reoxidation and its Oxygen-pressure-dependent Thermal Stability,Applied Physics Letters, vol. 78, No. 24, Jun. 11, 2001, pp. 3803-3805.
T. S. Jeon et al., Thermal Stability of Ultrathin ZrO2Films Prepared by Chemical Vapor Deposition on Si(100),Applied Physics Letters, vol. 78, No. 3, Jan. 15, 2001, pp. 368-370.
V. V. Afanas'ev et al., Pressure Dependence of Si/SiO2Degradation Supresion by Helium,Journal of Applied Physics, vol. 87, No. 10, pp. 7338-7341, May 2000.
Kurihara Kazuaki
Muraoka Kouichi
Jefferson Quovaunda
Kabushikik Kaisha Toshiba
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Smith Matthew
LandOfFree
Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4248343