Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S368000, C257SE29150, C257SE29139, C257SE27060

Reexamination Certificate

active

07737511

ABSTRACT:
There is provided a method of manufacturing a semiconductor device, including forming a structure including a first layer containing Si and a metal oxide layer in contact with the first layer, the metal oxide layer having a dielectric constant higher than that of silicon oxide, and heating the structure in an atmosphere containing He and/or Ne.

REFERENCES:
patent: 3852120 (1974-12-01), Johnson et al.
patent: 4282647 (1981-08-01), Richman
patent: 4317686 (1982-03-01), Anand et al.
patent: 4837172 (1989-06-01), Mizuno et al.
patent: 5998838 (1999-12-01), Tanabe et al.
patent: 6013553 (2000-01-01), Wallace et al.
patent: 6106734 (2000-08-01), Shindo et al.
patent: 6120597 (2000-09-01), Levy et al.
patent: 6208030 (2001-03-01), Tsui et al.
patent: 6352900 (2002-03-01), Mehrotra et al.
patent: 6465335 (2002-10-01), Kunikiyo
patent: 6486080 (2002-11-01), Chooi et al.
patent: 6552403 (2003-04-01), Lucovsky
patent: 6613658 (2003-09-01), Koyama et al.
patent: 6635517 (2003-10-01), Chen et al.
patent: 6693324 (2004-02-01), Maegawa et al.
patent: 6713819 (2004-03-01), En et al.
patent: 7422953 (2008-09-01), Muraoka et al.
patent: 2005/0054182 (2005-03-01), Wang
patent: 2005/0227463 (2005-10-01), Ito et al.
patent: 2005/0236626 (2005-10-01), Takafuji et al.
patent: 2008/0246094 (2008-10-01), Liaw et al.
patent: 3-46226 (1991-02-01), None
patent: 05-218355 (1993-08-01), None
patent: 10-209403 (1998-08-01), None
patent: 11-168212 (1999-06-01), None
patent: 2000-269483 (2000-09-01), None
patent: 2001-189312 (2001-07-01), None
patent: 2001-313292 (2001-11-01), None
patent: 2002-50624 (2002-02-01), None
J. P. Maria et al., High Temperature Stability in Lanthanum and Zirconia-based Gate Dielectrics,Journal of Applied Physics, vol. 90, No. 7, Oct. 1, 2001, pp. 3476-3482.
Heiji Watanabe, Interface Engineering of a ZrO2/SiO2/Si Layered Structure by in situ Reoxidation and its Oxygen-pressure-dependent Thermal Stability,Applied Physics Letters, vol. 78, No. 24, Jun. 11, 2001, pp. 3803-3805.
T. S. Jeon et al., Thermal Stability of Ultrathin ZrO2Films Prepared by Chemical Vapor Deposition on Si(100),Applied Physics Letters, vol. 78, No. 3, Jan. 15, 2001, pp. 368-370.
V. V. Afanas'ev et al., Pressure Dependence of Si/SiO2Degradation Supresion by Helium,Journal of Applied Physics, vol. 87, No. 10, pp. 7338-7341, May 2000.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4248343

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.