Semiconductor device and method of manufacturing the same,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support

Reexamination Certificate

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C438S108000, C438S117000, C438S123000, C257SE23070, C257S734000, C257S668000

Reexamination Certificate

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07662673

ABSTRACT:
A semiconductor device including: a semiconductor substrate in which an integrated circuit is formed; an insulating layer formed on the semiconductor substrate and having a first surface and a second surface which is higher than the first surface; a first electrode formed to avoid the second surface and electrically connected to the inside of the semiconductor substrate; and a second electrode formed on the second surface and electrically connected to the inside of the semiconductor substrate.

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U.S. Appl. No. 10/829,146, filed Apr. 21, 2004, Nobuaki Hashimoto.

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