Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S288000, C257S328000, C257S330000, C257S397000, C257SE29197, C257SE29201, C257SE21382

Reexamination Certificate

active

07659576

ABSTRACT:
A punch-through type IGBT generally has a thick p++-type collector layer. Therefore, the FWD need be externally attached to the IGBT when the IGBT is used as a switching element in an inverter circuit for driving a motor load, and thus the number of processes and components increases. In the invention, trenches are formed penetrating through a collector layer and reaching a buffer layer. A collector electrode is formed in the trenches, too. With this structure, a current path is formed between an emitter electrode and the collector electrode without through the collector layer and functions as the FWD.

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B. Jayant Baliga. (1996).Power Semiconductor Devices. PWS Publishing Company, pp. 432-434; 496-498.
European Search Report mailed Jun. 11, 2008, directed to counterpart EP application No. 07021414.3; 8 pages.

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