Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2006-02-09
2009-08-18
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
07577931
ABSTRACT:
A semiconductor device has power supply pads including a first power supply pad and at least one second power supply pad that are connected to internal power supply wirings through an internal circuit so that the first and second power supply pads are set to the same potential. The first power supply pad is bonded by a wire to a lead to which a supply voltage is applied and is connected to the round power supply wiring through a round power supply connection wiring. A signal pad from which electrostatic noise enters into the semiconductor device is provided. An input protection circuit is connected between the signal pad and the internal circuit and is connected to the round power supply wiring through a protection circuit power supply wiring. The second power supply pad is not bonded by a wire to a lead to which a supply voltage is applied and is not connected to the round power supply wiring so that when electrostatic noise enters the signal pad, the electrostatic noise is discharged to the exterior of the semiconductor device without the electrostatic noise being led to the internal circuit.
REFERENCES:
patent: 6161215 (2000-12-01), Hollenbeck et al.
patent: 6339234 (2002-01-01), Takizawa
patent: 6720636 (2004-04-01), Shimizu et al.
patent: 7199472 (2007-04-01), Minami et al.
Masuko Hiroyuki
Sato Yutaka
Adams & Wilks
Chiang Jack
Seiko Instruments Inc.
Tat Binh C
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